Power module reliability evaluation
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Start:
Power devices to which high voltages or large currents ar...
When operation is stopped, the temperature drops to the a...
Thus, the temperature rise and drop is repeated at each o...
Power devices are mounted on lead frames or copper-plated...
The power module is then encapsulated with a resin materi...
Since these materials have different coefficients of line...
Repeated stress changes during temperature rise and fall ...
In order to realize highly reliable systems, bonding mate...
We conduct evaluation by changing the method of heat appl...
#ref(./Reliability_eng.png,50%);
[[Research work]]
End:
Power devices to which high voltages or large currents ar...
When operation is stopped, the temperature drops to the a...
Thus, the temperature rise and drop is repeated at each o...
Power devices are mounted on lead frames or copper-plated...
The power module is then encapsulated with a resin materi...
Since these materials have different coefficients of line...
Repeated stress changes during temperature rise and fall ...
In order to realize highly reliable systems, bonding mate...
We conduct evaluation by changing the method of heat appl...
#ref(./Reliability_eng.png,50%);
[[Research work]]
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